Sikadur®-32 Hi-Mod is a multi-purpose, 2-component, 100 % solids,
moisture-tolerant structural epoxy adhesive. It conforms to the current
ASTM C-881 Types I, II, and V, Grade 2, Class C and AASHTO M-235
specifications.
Mixing Ratio: Component ‘A’: Component ‘B’ = 1:1 by volume
Product Temperature: Condition material to 65°-75°F (18°-24°C) before using.
Ambient Air Temperature: Minimum ambient temperature 40°F (4°C).
Substrate Temperature: Minimum substrate temperature 40°F (4°C).
Pot Life: Approximately 30 minutes. (60 gram mass)
Approximately 22 minutes. (350 gram mass)
Contact Time: 40 °F (4 °C)*: 15–16 h 73 °F (23 °C)*: 2–2.5 h 90 °F (32 °C)*: 1.5–2 h